High Thermal Conductivity Insulating Composite Powder
High-thermal-conductivity insulating composite powder is a gray fluffy nanopowder of boron nitride, aluminum nitride and silicon carbide, with purity above 99.9%, thermal conductivity up to 420 W/mK and resistivity above 1016 Ω·cm. It is used in thermal interface materials, silicone rubber and ceramics.
Product Overview
The high-thermal-conductivity insulating composite powder is a gray fluffy nanopowder whose main components are boron nitride, aluminum nitride and silicon carbide. It combines high purity (about 99.9%), small particle size, uniform distribution and a large specific surface area, with thermal conductivity up to 420 W/mK, close to that of copper, and electrical resistivity above 1016 Ω·cm. A typical loading of only 1–5% can bring a resin to about 3 W/mK, providing an alternative to nano-alumina or single-component boron nitride and aluminum nitride fillers.
| Product name | High-thermal-conductivity insulating composite powder |
| Appearance | Gray fluffy powder |
| Main components | Boron nitride, aluminum nitride, silicon carbide |
| Thermal conductivity | Up to 420 W/mK |
| Electrical resistivity | Above 1016 Ω·cm |
| Temperature resistance | Up to 2000°C |
| Purity | About 99.9% |
| Recommended loading | 1–5% |
Specification
| Item | CS01 | CS02 |
|---|---|---|
| Appearance | Gray fluffy powder | Gray fluffy powder |
| Purity | >99.9% | >99.9% |
| Specific surface area | 78 m²/g | 65 m²/g |
| Bulk density | 0.08 g/cm³ | 0.12 g/cm³ |
| Tap density | 1.34 g/cm³ | 1.34 g/cm³ |
| Average particle size | 40 nm | 100 nm |
Key Benefits
- Thermal conductivity up to 420 W/mK, close to copper
- Reliable electrical insulation with resistivity above 1016 Ω·cm
- Effective at a low loading of 1–5%
- High purity with extremely low surface oxygen content
- Easy to disperse and stable at high temperatures
Why a Composite Filler
Single fillers have practical limits: aluminum nitride raises viscosity and hydrolyzes after moisture absorption; beryllium oxide is toxic; boron nitride is costly and also increases viscosity at high filling; magnesium oxide absorbs moisture; and silicon oxide has low conductivity. The composite combines the strengths of these materials while avoiding these drawbacks.
Applications
- Thermal interface materials — thermally conductive silicone, thermal epoxy and thermal grease
- Thermally conductive plastics and high-conductivity silicone rubber
- Semiconductor and high-temperature tooling — crucibles for melting gallium arsenide, evaporation boats, thermocouple protection tubes and microwave dielectric ceramics
- Insulating materials — polyimide resin, insulation mica tape, insulating paint and heat transfer oil
Packing & Storage
- Packing: 25kg plastic bags
- Storage: keep sealed in a dry, cool environment; avoid long exposure to air, heavy pressure and contact with oxidizing agents
- Transported as normal cargo
FAQ
Q: What is this composite powder used for?
A: Thermal interface materials, thermally conductive plastics and silicone rubber, high-temperature ceramics and insulating materials.
Q: What is the difference between CS01 and CS02?
A: CS01 is 40 nm with a specific surface area of 78 m²/g; CS02 is 100 nm with 65 m²/g; both have purity above 99.9%.
Q: What loading is recommended?
A: About 1–5%, which can bring a resin to a thermal conductivity of around 3 W/mK.
Q: How is it packed and stored?
A: In 25kg plastic bags, kept sealed in a dry, cool place away from oxidants.
