Copper pyrophosphate -for plating materials

Copper pyrophosphate, with the CAS number 10102-90-6, is a chemical compound that is utilized in various applications, particularly in the electroplating industry. Here are some of its primary uses:

1. Plating Grade: It is extensively used in the electroplating industry to provide a decorative and protective copper layer. Due to its high purity, unique crystal structure, and extremely low levels of impurities such as iron, phosphorus, and arsenic, copper pyrophosphate is easier to chelate with potassium pyrophosphate. This results in a plating solution with excellent polarizing ability and current distribution, which allows for a fast plating ratio, smooth plating layer, and stable plating solution with simple maintenance .

2.Catalyst Grade: While not as commonly mentioned in the provided search results, copper pyrophosphate could potentially be used in catalyst applications due to its ability to form complexes and its role in various chemical reactions.

3.Other Applications: Beyond plating and catalysis, copper pyrophosphate may have other uses in chemical synthesis, as a precursor for other copper compounds, or in materials science, although specific details on these applications were not found in the provided search results.

It is important to handle copper pyrophosphate with care due to its potential toxicity and environmental impact, and to follow proper safety measures during its use and storage.